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BAT54J
Schottky barrier single diode
Rev. 01 -- 8 March 2007 Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier single diode with an integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package.
1.2 Features
I I I I Low forward voltage Very small and flat lead SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior
1.3 Applications
I Voltage clamping I Line termination I Reverse polarity protection
1.4 Quick reference data
Table 1. Symbol IF VR VF
[1]
Quick reference data Parameter forward current reverse voltage forward voltage IF = 1 mA
[1]
Conditions
Min -
Typ -
Max 200 30 320
Unit mA V mV
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
BAT54J
Schottky barrier single diode
2. Pinning information
Table 2. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
1 2
Symbol
1 2
sym001
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3. Ordering information Package Name BAT54J SC-90 Description plastic surface-mounted package; 2 leads Version SOD323F Type number
4. Marking
Table 4. BAT54J Marking codes Marking code AP Type number
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM IFSM Ptot Tj Tamb Tstg
[1]
Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current total power dissipation junction temperature ambient temperature storage temperature
Conditions
Min -
Max 30 200 300 600 550 150 +150 +150
Unit V mA mA mA mW C C C
tp 1 s; 0.5 square wave; tp < 10 ms Tamb 25 C
[1]
-65 -65
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
2 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1][2]
Min -
Typ -
Max 230 55
Unit K/W K/W
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Reflow soldering is the only recommended soldering method. Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR Cd
[1]
Conditions
[1]
Min -
Typ -
Max 240 320 400 500 800 2 10
Unit mV mV mV mV mV A pF
reverse current diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 25 V VR = 1 V; f = 1 MHz
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
3 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
103 IF (mA) 102
(1) (2) (3)
msa892
103 IR (A) 102
(2) (1)
msa893
10
10
1
(1)
(2) (3)
1
(3)
10-1
0
0.4
0.8
VF (V)
1.2
10-1 0
10
20
VR (V)
30
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C
Fig 1. Forward current as a function of forward voltage; typical values
Fig 2. Reverse current as a function of reverse voltage; typical values
msa891
15 Cd (pF)
10
5
0
0
10
20
VR (V)
30
Tamb = 25 C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
4 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
8. Package outline
1.35 1.15 1 0.5 0.3 0.80 0.65
2.7 2.3
1.8 1.6
2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13
Fig 4. Package outline SOD323F (SC-90)
9. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BAT54J
[1]
Package SOD323F
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 13.
10. Soldering
3.05 2.80 2.10 1.60
solder lands solder resist
1.65
0.95
0.50
0.60 occupied area solder paste
0.50 (2x)
001aab169
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 5. Reflow soldering footprint SOD323F (SC-90)
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
5 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
11. Revision history
Table 9. BAT54J_1 Revision history Release date 20070308 Data sheet status Product data sheet Change notice Supersedes Document ID
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
6 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
BAT54J_1
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 -- 8 March 2007
7 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 3 3 5 5 5 6 7 7 7 7 7 7 8
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 March 2007 Document identifier: BAT54J_1

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